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Welcome to Visit Ziitek booth B100
May 13, 2026Ziitek Technology will showcase 20 years of Thermal Innovation at 2026 Global data center Innovative development and application o
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Thermal graphite sheet solve the problem of difficult heat dissipation of mobile phone chips.
May 11, 2026Thermal conductive graphite sheet can easily solve the problem of difficult heat dissipation of mobile phone chipsThe heat dissipa
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Ziitek TS-TIR700-25 Carbon Fiber Heat Conductive Gasket: A New High-Performance Cooling Option
May 8, 2026Ziitek TS-TIR700-25 Carbon Fiber Heat Conductive Gasket: A New High-Performance Cooling Option In today's era of rapid it
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ZIITEK New Thermal conduction material ----TIG7835N Liquid Metal
April 22, 2026ZIITEK New Thermal conduction material ----TIG7835N Liquid Metal for Heat Dissipation in Consumer Electronics, Achieving Unma
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Ziitek thermal and absorbing wave material: Empowering stable operation of electronic devices
April 8, 2026In the current era where electronic devices are evolving towards miniaturization and high performance, heat dissipation and electr
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The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad
March 24, 2026The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad has a heat conductivity co
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Thermal silicone sheet: The "invisible guardian" for effective heat dissipation of switching power
August 15, 2025Thermal silicone sheet: The "invisible guardian" for effective heat dissipation of switching power supplyIn the heart of
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ZIITEK technology: an innovation leader in the field of heat dissipation materials in the AI era
July 22, 2025ZIITEK technology: an innovation leader in the field of heat dissipation materials in the AI eraIn today's era of rapid develo
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Welcome to visit ZIITEK booth at 2025 MWC Shanghai
June 13, 2025Ziitek sincerely invites you to attend the 2025 MWC Shanghai exhibition.ZIITEK Booth: N2. A83Date: 18th to 20th June 202
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Introduction of Ziitek thermal pads-- Soft, tear-proof and puncture-proof
July 8, 2024Introduction of Ziitek thermal pads-- Soft, tear-proof and puncture-proofZiitek thermal pads are made of silica gel
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2024 Vetnam International Electronic Components and Production Equipment Exhibition.
June 14, 2024Dongguan Ziitek Electronical Material and Technology Comapany sincerely invite you to attend in 2024 Vetnam Internationa
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Ziitek Comapany invites you to participate in 2024 Taipei International Computer Exhibition.
May 27, 20242024 Taipei International Computer Exhibition: Ziitek Technology invites you to a technology appointment.Dongguan ZIITEK electroni
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Thermal Conductive Phase Change Materials: Unlocking the Secret of Efficient Heat Dissipation
April 26, 2024Inside electronic devices, heat accumulates as high-performance chips continue to work, threatening the stable operation of the de
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What is the effect of thermal conductive graphite sheet without edge?
April 7, 2024What is the effect of thermal conductive graphite sheet without edge?Thermal conductive graphite sheet is an ultra-thin and l
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Advantage and Disadvantage of using potting glue for PCB board
March 21, 2024Advantage and Disadvantage of using potting glue for PCB board The advantages and disadvantages of using thermal conduct
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What is the effect of thermal conductive graphite sheet without edge?
March 18, 2024What is the effect of thermal conductive graphite sheet without edge? Thermal conductive graphite sheet is an ultra-thin
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Advantages of thermal gel using on mobile phone
March 18, 2024Advantages of thermal gel using on mobile phone Mobile phone has always been an indispensable personal item in our
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The specific application of heat conduction sheet in heat dissipation of electronic components
March 13, 2024The specific application of heat conduction sheet in heat dissipation of electronic componentsThe specific application of heat con
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Why we choose thermal pads for NEV batteries
March 13, 2024Why we choose thermal pads for NEV batteriesWhy we choose thermal pads for NEV batteries The reasons why new energy
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WHY CHOOSE
OUR PRODUCTS?
Company Overview
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Manufacturer Business Type
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2006 Year Established
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Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler, Thermal gap pad Main Products
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3,000-5,000 square meters Factory Size
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201 - 300 People Total Employees
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Above 100 People Sales Staff
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10-20 People Quality Inspectors
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ISO9001, ISO14000, ISO16949 Product Certifications
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North America, South America, Eastern Europe, Western Europe, Northern Europe, Southern Europe Main Markets
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Dongguan Port of Shipment
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Glass Wool Main Industry