Ziitek TS-TIR700-25 Carbon Fiber Heat Conductive Gasket: A New High-Performance Cooling Option

Ziitek TS-TIR700-25 Carbon Fiber Heat Conductive Gasket: A New High-Performance Cooling Option 

In today's era of rapid iteration in 5G communication, high-performance computing, wearable devices and optoelectronic products, device power consumption is continuously increasing and the structure is becoming increasingly compact. Heat dissipation has become a key bottleneck restricting performance and reliability. Traditional thermal conductive materials struggle to balance ultra-thinness, high thermal conductivity and low thermal resistance. Makko Technology has launched the TS-TIR®700-25 series carbon fiber thermal pads, using an innovative carbon-based composite structure, to provide an efficient, stable and lightweight interface heat dissipation solution for high heat flux scenarios. 

The TS-TIR®700-25 is composed of high thermal conductivity carbon fibers and high molecular silicone rubber, and through precise manufacturing techniques, it forms a continuous and directional heat-conducting path, achieving a stable thermal conductivity of 25W/m•K. According to the ASTM D5470 standard test, its thermal performance far exceeds that of conventional silicone gasket. The material can efficiently conduct heat under low pressure, significantly reducing the interface thermal resistance. With a thickness of 0.3mm, the thermal impedance is as low as 0.35℃・in²/W, allowing the heat from the chip to be quickly conducted to the heat dissipation module, avoiding local overheating and frequency reduction. 

This gasket combines ultra-thinness and flexibility, with a thickness ranging from 0.3 to 5.0mm. Standard specifications include 0.3/0.5/1.0/1.5/2.0/2.5/3.0mm. It can meet the filling requirements for various gaps. The hardness is Shore 00 60–85, with a compression rate up to over 80%. It can closely adhere to rough surfaces under minimal pressure without requiring high locking force. It is suitable for precision components and thin structures. The density is 2.9g/cc, which offers significant lightweight advantages, helping to reduce the weight and increase efficiency of the equipment. 

In terms of reliability and safety, the TS-TIR®700-25 performs exceptionally well. It operates within a temperature range of -40℃ to 200℃, capable of adapting to harsh environments with both high and low temperatures; its flame retardancy level reaches UL94 V-0, meeting the safety requirements for electronic devices; the entire series complies with the RoHS environmental directive, free of harmful substances, and is suitable for global market access. The material is non-insulating and has no surface stickiness, facilitating easy assembly, being resistant to dust accumulation and displacement, and convenient for production line automation and later maintenance. 

With its outstanding performance, this gasket is widely used in scenarios with high heat dissipation demands such as between chips and heat sinks, 5G communication equipment, optical modules, and wearable devices. Whether it is base station power amplifiers, high-speed optical modules, or thin and light laptops, smart wearables, it can stably perform heat dissipation functions, improving device battery life, extending lifespan, and ensuring long-term reliable operation. 

Ziitek Technology offers die-cutting customization services. It can be processed into various shapes according to customer requirements. Larger specifications and special thicknesses can be flexibly connected. The TS-TIR®700-25, with its superior thermal conductivity, low thermal resistance, ultra-thin flexibility and high reliability, has become the preferred material for the next generation of electronic heat dissipation. It helps high-end electronic devices break through the heat dissipation bottleneck and embrace a more efficient and stable future.