The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad

The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad has a heat conductivity coefficient of up to 25w/m.k and a thermal resistance as low as 0.05 ℃.cm²/w.

In the era of rapid technological development, AI chips, as the core "brain" of the artificial intelligence field, are driving changes in various industries at an astonishing speed. However, as the computing power of AI chips continues to increase, the heat they generate has become a challenging problem that needs to be addressed urgently. At this point, Ziitek carbon fiber heat dissipation gaskets stand out with their outstanding performance and have become a powerful assistant for the heat dissipation of AI chips.

The "heat crisis" of AI chips

During the operation of AI chips, due to the need for processing and handling massive amounts of data, the internal transistors and other components of the chips will continuously operate at high speed, thereby generating a large amount of heat. According to research, for every 10℃ increase in chip temperature, its reliability may decrease by approximately 50%. Therefore, efficient heat dissipation is crucial for maintaining the stable and efficient operation of AI chips.

Ziitek carbon fiber thermal pad "makes its debut"

Ziitek, as an enterprise that has been deeply engaged in the materials field for many years, focuses on the research, development, manufacturing and sales of innovative functional materials such as thermal interface materials and EMC materials. It has achieved remarkable results in cooling solutions and has obtained a number of patents and honors. The company's carbon fiber thermal pad is specifically designed to solve the heat dissipation problems of high-power chips.

Excellent thermal conductivity performance

The Ziitek TS-TIR700-25 is an efficient carbon fiber heat transfer gasket, combining high thermal conductivity carbon fibers with high molecular silicone materials.It precisely distributes the heat transfer pathways through advanced technology, achieving excellent thermal conductivity performance, effectively reducing interface thermal resistance and enhancing heat dissipation efficiency. It features ultra-thinness, light weight, and mechanical flexibility, and is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

Demonstrate one's capabilities through application

The AI chip of Company H is mainly applied in low-power fields such as edge computing products and mobile devices. In edge computing scenarios like security monitoring, autonomous driving, and intelligent manufacturing, this chip can provide powerful real-time inference capabilities, enabling it to quickly analyze and process collected images, videos, and other data, and achieving artificial intelligence functions such as target recognition and behavior analysis.

Application Features:

Thermal conductivity: 25 W/mK

Extremely low thermal resistance

Operates under low pressure

Non-insulating material

No surface stickiness

Product thickness: 0.3mm - 5.0mm

Thermal resistance ≤ 0.05 (℃in2/W)

Compression rate ≥ 25% (50 psi)

https://www.ziitek.com.vn/

Future Outlook

With the continuous development of AI technology, the performance of AI chips will keep improving, and the demand for heat dissipation will also increase. Ziitek will continue to invest in research and development, constantly optimize the performance of carbon fiber heat transfer pads, and provide higher-quality and more efficient heat dissipation solutions for AI chips. At the same time, Ziitek will expand its product application fields, shining in more industries such as ICT communication, data centers, and new energy vehicles, and helping to upgrade and develop the technologies of various industries.

The Ziitek carbon fiber thermal pad has demonstrated remarkable strength in the field of AI chip cooling, becoming a crucial component for ensuring the stable operation of AI chips. It is believed that in the future, it will play an important role in more fields and drive technological progress to new heights.