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Advantage and Disadvantage of using potting glue for PCB board

The advantages and disadvantages of using thermal conductive potting glue for circuit boards are as follows:

The advantages: 

1. protect the circuit board: thermal conductivity potting adhesive can effectively protect the circuit board, prevent it from being affected by the external environment, such as moisture, dust, vibration, etc.
2. improve electrical performance: thermal conductivity potting adhesive has excellent electrical performance and insulation ability, can effectively improve the electrical performance and stability of the circuit board.
3. enhance thermal conductivity: thermal potting adhesive has good thermal conductivity, can transfer the heat generated by the circuit board to the surrounding environment, so as to reduce the operating temperature of the circuit board.
4. improve weather resistance: some thermal conductivity potting adhesive has good weather resistance, can maintain its performance in harsh environmental conditions stable, so as to extend the service life of the circuit board.

The disadvantages:

1. high cost: some good thermal conductivity potting adhesive price is high, will increase the manufacturing cost of the circuit board.
2. difficult to operate: the operation of thermal conductivity potting glue requires certain professional skills and experience, if improper operation may cause damage to the circuit board.
3. Long curing time: some thermal conductive potting adhesives need long curing time, which will affect production efficiency.
4. Environmental protection: Some thermal conductive potting adhesives may have a certain impact on the environment in the process of production and use.